Thermal Conductive
Bending Strength
Density
Surface Roughness
Warpage
Ascendus uses tape casting process to produce substrates. According to different metallization requests we also developed many subdivisions: as fired, lapped, polished and laser scribed(cut).
AlN have already helped to achieve very low thermal resistance in many different applications, such as LED, power modules, RF components, laser package …… We feel very happy to always approach new technologies and devote some efforts in it.
○ Standard thermal conductivity: ≥170W/m·k
○ Ultra thermal conductivity: 200W/m·k
○ Varieties of matallizations: DPC, DBC, TPC, AMB, Thick Film, Thin Film
○ Total in house production
○Ultra thin: 0.15mm
○ Reliable quality control