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As Fired Substrate


As fired substrate is sintered very flat, no need to lap down the surface and you can make the metallization directly on it. 


With very dense surface, as fired type is a very good choice for the DPC or other tough metallization processes.



Sample Requirement List



1. Characteristics


Item

Unit

As-fired

Lapped

Color

-

Gray/Beige

Gray/Beige

Surface Roughness (Ra)

μm

0.3-0.4

0.5-0.7

Warpage

2.5

2.5

Volume Density

g/cm3

≥3.24

≥3.24

Bending Strength

MPa

350

350

Thermal Conductivity [@20]

  W/m·k

≥170

≥170

Coefficient of Linear   Expansion [RT-300

10-6mm/

4.6

4.6

Volume   Resistance

Ω·cm

1.5×1013

1.5×1013

Dielectric   Constant   [@1MHz]

-

10.6

10.6

Dielectric   Loss   [@1MHz]

-

4.6×10-4

4.6×10-4

Dielectric   Strength

(KV/mm)

≥20

≥20

  

2. Standard types

 

Thickness

(mm)

Substrate Size(inch)

2*2

4*4

4.5*4.5

5*5

0.381

0.50

0.635

1.0

1.5

2.0

 

3. Matallization 


QQ截圖20190506133853.jpg



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