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AlN HTCC

中国足彩网系统异常 www.hvity.com

The best inorganic package solution for UVC


A Whole package with very good air tightness


Very good thermal conductivity




Sample Requirement List

1.Overall Technical Indicators


Specification of green tape:6''*6'',thickness:120-200μm.

Minimum Linewidth of HTCC printing:100μm.

Minimum spacing of HTCC printing:100μm.

HTCC conductor printing thinckness:7-20μm.

Warpage＜3μm/mm.

HTCC layers:3-30 layers.

Shrinkage of raw porcelain sheets:17.4+1% in the direction of XY axis; In the direction of Z axis 25.9+3%.


2.Layout design reference schematic


image.png


Layout design reference


ItemNoMinSuggest
Through hole diameterA0.15mm0.20mm
PadBA+(0.1-0.2)mm
Through-hole spacingC2.5 times through hole diameter3 times through hole diameter
Conductor widthD0.15mm0.20mm
Conductor spacing E0.10mm0.20mm


3.Design reference of grid ground and grid power layer


image.png            image.png


Design reference dimensions of grid ground and grid power layer


ItemNoSize
Grid linewidthA0.2mm-0.4mm
Grid spacingB0.3mm-0.4mm
Spacing between grid network and padC0.2mm


4.Through hole schematic


image.png

         Signal hole      Cooling hole        Shielding hole


Through-hole diameter


Through-hole diameter

(mm)

0.150.200.300.50


5.Cavity design reference


ItemSize
Cavity depth0.1-0.3mm
Distance from cavity bottom to substrate bottom＞0.38mm
Cavity spacing＞0.5mm
Edge spacing between cavity and substrate＞0.5mm
Spacing between through hole and edge of cavity＞25times through hole diameter
Distance between wire and cavity edge＞0.2mm




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