1.Overall Technical Indicators
Specification of green tape:6''*6'',thickness:120-200μm.
Minimum Linewidth of HTCC printing:100μm.
Minimum spacing of HTCC printing:100μm.
HTCC conductor printing thinckness:7-20μm.
HTCC layers:3-30 layers.
Shrinkage of raw porcelain sheets:17.4+1% in the direction of XY axis; In the direction of Z axis 25.9+3%.
2.Layout design reference schematic
Layout design reference
|Through hole diameter||A||0.15mm||0.20mm|
|Through-hole spacing||C||2.5 times through hole diameter||3 times through hole diameter|
3.Design reference of grid ground and grid power layer
Design reference dimensions of grid ground and grid power layer
|Spacing between grid network and pad||C||0.2mm|
4.Through hole schematic
Signal hole Cooling hole Shielding hole
5.Cavity design reference
|Distance from cavity bottom to substrate bottom||＞0.38mm|
|Edge spacing between cavity and substrate||＞0.5mm|
|Spacing between through hole and edge of cavity||＞25times through hole diameter|
|Distance between wire and cavity edge||＞0.2mm|