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Lapped substrate 


Lapped substrate can achieve very flat surface and uniform roughness. It is very suitable for thick film process. 




Sample Requirement List


1. Characteristics

 

Item

Unit

As-fired

                 Lapped

Color

-

Gray/Beige

Gray/Beige

Surface Roughness (Ra)

μm

0.3-0.4

0.5-0.7

Warpage

2.5

2.5

Volume Density

g/cm3

≥3.24

≥3.24

Bending Strength

MPa

350

350

Thermal Conductivity [@20]

W/m·k

≥170

≥170

Coefficient of Linear Expansion [RT-300]

10-6mm/

4.6

4.6

Volume Resistance

Ω·cm

1.5×1013

1.5×1013

Dielectric Constant  [@1MHz]

-

10.6

10.6

Dielectric Loss [@1MHz]

-

4.6×10-4

4.6×10-4

Dielectric   Strength

(KV/mm)

≥20

≥20

 

2. Standard Types

 

Thickness

(mm)

Substrate Size(inch)

2*2

4*4

4.5*4.5

5*5

0.381

0.50

0.635

1.0

1.5

2.0

 

3. Matallizations 


QQ截圖20190506133853.jpg



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